Electroless Copper Plating (without CH2O) ; Environmental protection formaldehyde-free chemical copper plating
Electroless Copper Plating (without CH2O)
Product Details
Environment friendly electroless copper plating, the use of new reducing agent instead of traditional formaldehyde as reducing agent.
Copper sinking speed 3~6μm/h, Up to a maximum thickness of up to 25μm or above, low operating temperature, good stability of plating solution.
Process Specification Conditions
| FF-7608A | 60ml/L |
| FF-7608B | 120ml/L |
| FF-7608C | 40ml/L |
| FF-7608D | 40ml/L |
| FF-7608E | 1ml/L |
| FF-7608F | 25ml/L |
| Temp. | 48~55℃ |
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